The process: Purification, Oxidation, Photo-lithography, Alignment and Exposure, Etching, Diffusion, and Metalization. My role: Follow a Standard Operating Procedure while sharing tasks depending upon specific process step. The skills: Understand and facilitate laboratory machines and processes such as: photo-resist spinner, ultraviolet light exposure, mask alignment, purification solution measurements, oxidation furnaces, and testing probes. The environment: Work within a small team to follow instructions, determine unique time-based or measurement-based decisions, and delegate responsibilities. The reward: Take home a 3-inch wafer composed of multiple CMOS structures including: NMOS, PMOS, NPN, PNP, NCAP, PCAP, Inverter, BJT, and others.